Poster: Micro-Pump With No-Moving-Part Valves

Micro-Pumps With No-Moving-Part Valves
University of Washington, Seattle, U.S.A.
Dept of Mechanical Engineering: Fred K. Forster, Ron L. Bardell, Nigel R. Sharma,
Robert J. Penney*, Chris Morris, Ling-Sheng Jang, Andrew Kiehl
Dept of Electrical Engineering: Marty A. Afromowitz, Shuliang Li
Sponser: Defense Advanced Research Projects Agency.

* Former group members.

The wafer is then subjected to an etching process. This removes silicon from any regions unprotected by the photoresist. Depending on the design our wafers are etched to depths of 30 to 400 microns using a process commonly referred to as deep reactive ion etch (RIE).