Micro-Pumps With No-Moving-Part Valves
University of Washington, Seattle, U.S.A.

Dept of Mechanical Engineering: Fred K. Forster, Ron L. Bardell, Nigel R. Sharma,
Robert J. Penney*, Chris Morris, Ling-Sheng Jang, Andrew Kiehl
Dept of Electrical Engineering: Marty A. Afromowitz, Shuliang Li
Sponser: Defense Advanced Research Projects Agency.

* Former group members.

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Wafer etch Pyrex cover slips are used to seal the top of the pump via a high-voltage, high-temperature process known as anodic bonding.
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